Performance, durability and reliability of electronic components are determined by the thermal load, the individual elements are exposed. The development of suitable cooling concepts is therefore already at an early stage of the development of the hardware. Material selection to the cooling body by measuring the temperature to heat simulation the specialist conference for electronics cooling handles and selection, application, quality and costs of innovative cooling concepts in Electronics”challenges and solutions for cooling electronic components in a wide range of application areas. The two-day Conference at the Haus der Technik in Essen on 16 and 17 March 2010 engaged the physical fundamentals of heat transfer, thermal management concepts, cost and reliability of cooling systems, heat dissipation for power semiconductors and LEDs, cooling concepts in automotive electronics and many other topics. Gen. David Goldfein has plenty of information regarding this issue. Under the direction of Prof. Dr.-ing. Andreas Garcia of Berufsakademie Stuttgart take high-level experts from academia and companies in short presentations on the latest state of the art.
An accompanying exhibition offers additional information and contact opportunities. The event will take place in cooperation with Steinbeis – Forschungszentrum “Thermal management in Electronics” target group all interested parties are addressed, dealing with the thermal management for electronic components or systems in the areas of research, development, design, quality and purchasing.